- Automated Fluid Dispensing Systems for solder paste, solder mask, encapsulant and adhesive.
- Plasma Treatment System
- For Semiconductor, Wafer Level Packaging, Printed Circuit Board and Life Science industries
- Multifunctional Bond Testers
- Pull, Shear test unit designed for your application.
- Advanced software features for Operator.
- Automated Wafer Inspection and Metrology Systems
- Outstanding 2D and 3D capabilities in a versatile and flexible platform
- Non-Contact Surface Measurement Systems
- Highly accurate measurement of micro-and nanostructures
- 3D optical measurement system, 3D laser profilometer
- Tape and Reel and Mass Lead Trimming Equipments
- PCB Vacuum Laminating System
- Hot Press and Cold Press Systems
- Abrasive Cutters, Precision Saws, Mounting Presses, Grinder and Polishers
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