- Automated Fluid Dispensing Systems for solder paste, solder mask, encapsulant and adhesive. - Plasma Treatment System - For Semiconductor, Wafer Level Packaging, Printed Circuit Board and Life Science industries - X-ray Inspection System - Up to 70 degree oblique angle views - Uninterrupted rotating live oblique views 360 degrees around any point in the sample - Automated Wafer Inspection and Metrology Systems - Outstanding 2D and 3D capabilities in a versatile and flexible platform - Laser Decapsulation System - Encapsulant removal from ALL types of packaged device - Circuitry can often be revealed without acid - Acid & Alkaline Cleaning - Photo-resist stripping - Tin and tin/ lead stripping - Dry film developing - Acid and alkaline etching - Customized Equipments - Process Integration - Flip Chip Placer - Insertion of Odd components - Lasermarking Systems - Post Wire Bond Inspection - High Speed Tape and Reel - UV Wafer Eraser Machine - Wafer Transfer Equipments - Multifunctional Bond Testers - Pull, Shear test unit designed for your application. - Advanced software features for Operator. - Tape and Reel and Mass Lead Trimming Equipments - Advanced Dispensing Robots - Conventional Time/ Pressure Controlled Dispensers - High-precision Systems - Non-Contact Surface Measurement Systems - Highly accurate measurement of micro-and nanostructures - 3D optical measurement system - Abrasive Cutters, Precision Saws, Mounting Presses, Grinder and Polishers       Home • About Us • Contact Us Copyright © 2010 Maxtronix, Inc.®. All rights reserved.